Product Parameter
| Parameters | Specification | ||||||
| Model | DGF | ||||||
| Screen Frame Size | 470mm x 370mm~737mm x 737mm | ||||||
| Substrate Handling Size (minimum) | 50mm (X) x 50mm (Y) | ||||||
| Substrate Handling Size (maximum) | 510mm (X) x510mm (Y) | ||||||
| Cycle Time | 7s | ||||||
| Screen Frame Thickness | 20mm - 40mm | ||||||
| Substrate Thickness | 0.4mm - 6mm | ||||||
| Print Pressure | 0kg - 20kg | ||||||
| Print Speed | 1 - 200mm/s | ||||||
| Print Gap | 0mm - 20mm | ||||||
| Substrate Separation |
Speed:0.1- 20mm/sec Distance:0mm - 20mm |
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| Apply paste option | Solder paste，Printing ink, Silver paste | ||||||
| Voltage | 220Volts +/- 10%.Single phase 50/60Hz | ||||||
Application Scenario
5G
Semiconductor
3C Products
Photovoltaic Products
New Display
Automotive Electronics
Medical Treatment
New Energy
Product Advanced
Options
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01Solder Paste Monitoring SystemThe sensor will detect the diameter of solder paste remained under the front squeegee to remind the opreator to supply paste.
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The above scheme is for reference only and can be customized according to the actual production technical requirements. Please leave your message to facilitate the staff to communicate with you and customize your own plan.
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